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Technologies

Precision Eutectic and Epoxy Die Attach

Microsembly demonstrates expertise in both eutectic and epoxy die attach processes, consistently delivering high-quality results for customers. Our experienced engineering team possesses in-depth knowledge of the unique advantages and appropriate applications for each die attach method. We leverage this expertise to provide customers with trusted guidance on selecting the optimal process for their specific device and performance requirements. Whether eutectic or epoxy, Microsembly implements robust process controls and rigorous quality assurance, enabling us to achieve precision, void-free die attach with maximized thermal and electrical conduction. Our proven capabilities with both techniques, and ability to clearly communicate the trade-offs between them, positions Microsembly as a dependable partner for supporting a wide range of die attach needs in electronics manufacturing. With a variety of epoxy types in our inventory, including renowned brands like Epo-Tek, Namics and Henkel, we cater to a variety of manufacturing requirements.

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Eutectic:

Eutectic die attach is utilized when the thermal or electrical performance requirements exceed the capabilities of epoxy-based processes. Eutectic bonding requires metallization of the backside of the die, typically with gold or silver. The die is bonded to a metallized substrate pad by first placing a preform of the eutectic alloy on the pad, then using a eutectic die bonder to align the die and apply heat and pressure to melt the eutectic. This forms a low-impedance, high thermal conductivity joint after resolidification. Rework of eutectic die attach is achieved by heating to remelt the eutectic, removing the die, cleaning the substrate pad, applying fresh eutectic preform and bonding a new die. The liquidus temperature, composition control, and surface metallizations of the eutectic alloy are critical parameters impacting the process window and reliability of eutectic die attach in electronics manufacturing. With rigorous process controls, eutectic die attach delivers void-free superior thermomechanical performance essential for high-power and high-frequency devices.

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Epoxy:

Precise control and optimization of epoxy die attach processes are imperative for manufacturing a wide range of microelectronic and optoelectronic devices. Maintaining stringent tolerances on epoxy bond line thickness is critical for ensuring effective thermal management. Bond lines must be highly uniform and free of voids to minimize thermal impedance from die to substrate or leadframe. Full epoxy coverage underneath the entire die footprint is essential to prevent hot spots and premature failure. Utilizing advanced techniques such as vacuum processing during epoxy cure reduces void formation, while optimized epoxy rheology and substrates with proper surface energy enable void-free filled fillets. With robust process controls and in-depth materials science expertise, we achieve repeatable epoxy coverage with minimal bond line variability and virtually no risk of voiding-induced failure. This level of epoxy process capability is required to meet the thermomechanical reliability requirements of today's electronics.