Ball Bonding:
Microsembly performs gold (Au) ball bonding for wire diameters ranging from 0.0007" (17 μm) to
0.002" (50 μm), enabling fine pitch interconnections. Ball bonding processes utilize
thermocompression or ultrasonic energy to join gold wire to aluminum or gold contact pads. We
employ optimized bonding parameters and advanced techniques including reverse bonding,
die-to-die bonding, and deep access bonding at varying heights within packages. These
capabilities facilitate low loop profiles and complex interconnects between multiple die or
substrate levels. Our extensive expertise in gold ball bonding is applied across a wide variety
of packages, including ceramic packages, open-cavity plastic encapsulated packages, and printed
circuit boards (PCBs). With rigorous process controls for bond quality and comprehensive
reliability testing, we achieve precision ball bonding that withstands thermomechanical stresses
and enables reliable electrical conduction within demanding microelectronic assemblies.